Title:
チップホルダ及びホルダユニット
Document Type and Number:
Japanese Patent JP5332344
Kind Code:
B2
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Inventors:
Masao Yamamoto
Haruo Wakayama
Haruo Wakayama
Application Number:
JP2008169830A
Publication Date:
November 06, 2013
Filing Date:
June 30, 2008
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B28D5/00; B28D1/24
Domestic Patent References:
| JP9249427A | ||||
| JP7223828A | ||||
| JP57023452Y2 | ||||
| JP9278474A | ||||
| JP3370314B2 | ||||
| JP2007118355A | ||||
| JP61150833U | ||||
| JP59088428U | ||||
| JP9085734A |
Attorney, Agent or Firm:
Yoshiki Okamoto