Title:
半導体装置
Document Type and Number:
Japanese Patent JP5481104
Kind Code:
B2
Abstract:
A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. The third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.
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Inventors:
Kentaro Ochi
Akira Mishima
Takuro Kanazawa
Tetsuro Iijima
Katsuo Ishizaka
Norio Kido
Akira Mishima
Takuro Kanazawa
Tetsuro Iijima
Katsuo Ishizaka
Norio Kido
Application Number:
JP2009140454A
Publication Date:
April 23, 2014
Filing Date:
June 11, 2009
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L25/07; H01L25/10; H01L25/18
Domestic Patent References:
| JP2004241734A | ||||
| JP2003168769A | ||||
| JP2002270736A | ||||
| JP2004311685A | ||||
| JP2008098308A |
Attorney, Agent or Firm:
Yamato Tsutsui