Title:
研磨剤及びこの研磨剤を用いた基板の研磨方法
Document Type and Number:
Japanese Patent JP5569574
Kind Code:
B2
Abstract:
Disclosed is a polishing agent comprising: water; tetravalent metal hydroxide particles; and an additive, wherein the additive contains at least one of a cationic polymer and a cationic polysaccharide. The present invention can provide a polishing agent which is capable of polishing an insulating film at a high speed with less polishing flaws, and having a high polishing rate ratio of a silicon oxide film and a stopper film, in the CMP technology of flattening insulating film. The present invention can also provide a polishing agent set for storing the polishing agent, and a method for polishing a substrate using this polishing agent.
More Like This:
Inventors:
Star Yosuke
Daisuke Ryuzaki
Naoyuki Koyama
Field part 茂
Daisuke Ryuzaki
Naoyuki Koyama
Field part 茂
Application Number:
JP2012223009A
Publication Date:
August 13, 2014
Filing Date:
October 05, 2012
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/304; B24B37/00; B24B37/04; B24B37/11; C09K3/14
Attorney, Agent or Firm:
Hidekazu Miyoshi
Yukikuni Iwasaki
Toshikazu Takahashi
Masakazu Ito
Toshio Takamatsu
Yukikuni Iwasaki
Toshikazu Takahashi
Masakazu Ito
Toshio Takamatsu