Title:
ＳＯＮ半導体基板の製造方法
Document Type and Number:
Japanese Patent JP5585056
Kind Code:
B2
Inventors:
Hideaki Teranishi
Application Number:
JP2009263807A
Publication Date:
September 10, 2014
Filing Date:
November 19, 2009
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
H01L27/12; H01L21/764
Attorney, Agent or Firm:
Yoichi Matsumoto