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Title:
リソグラフィック・プロセスに於ける、プロセス制御方法およびプロセス制御装置
Document Type and Number:
Japanese Patent JP5634864
Kind Code:
B2
Abstract:
A method and apparatus for process control in a lithographic process are described. Metrology may be performed on a substrate either before or after performing a patterning process on the substrate. One or more correctables to the lithographic patterning process may be generated based on the metrology. The patterning process performed on the substrate (or a subsequent substrate) may be adjusted with the correctables.

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Inventors:
アデル・マイケル
フィールデン・ジョン
ウィドマン・アマー
ロビンソン・ジョン
チョイ・ドンサブ
Application Number:
JP2010510538A
Publication Date:
December 03, 2014
Filing Date:
May 30, 2008
Export Citation:
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Assignee:
ケーエルエー−テンカー・コーポレーションＫＬＡ−ＴＥＮＣＯＲ ＣＯＲＰＯＲＡＴＩＯＮ
International Classes:
H01L21/027; G03F7/20; H01L21/66
Attorney, Agent or Firm:
Patent business corporation Akinari international patent firm



 
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