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Title:
電子装置の表面材料の外観的同時除去
Document Type and Number:
Japanese Patent JP5643845
Kind Code:
B2
Abstract:
There is provided an electronic device (200) comprising: a housing (16) comprising: an outer periphery member (220) comprising: a first outer periphery member (424) defining a first portion of an exterior sidewall, the first outer periphery member formed from a conductive material; and a second outer periphery member (426) defining a second portion of the exterior sidewall, the second outer periphery member formed from the conductive material; an internal platform (240) that extends between the first outer periphery member (424) and the second outer periphery member (426); a front cover assembly (350) comprising a front glass housing member defining at least a portion of a front surface of the electronic device and coupled to the outer periphery member; and a back cover assembly (360) comprising a back glass housing member defining at least a portion of a back surface of the electronic device and coupled to the outer periphery member.

Inventors:
マイヤーズ スコット
ヘリー リチャード
テオバルト マシュー
スタニャーロ アダム
タン タン
ディン リチャード
パクラ ディヴィッド
Application Number:
JP2012551959A
Publication Date:
December 17, 2014
Filing Date:
September 24, 2010
Export Citation:
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Assignee:
アップル インコーポレイテッド
International Classes:
B29C65/00
Attorney, Agent or Firm:
辻居 Koichi
Sadao Kumakura
Fumiaki Otsuka
Takayoshi Nishijima
Hiroshi Uesugi
Naoki Kondo