Title:
半導体素子用基板の製造方法および半導体装置
Document Type and Number:
Japanese Patent JP5672652
Kind Code:
B2
Abstract:
Provided is a manufacturing method of a substrate for a semiconductor element, the manufacturing method including the steps of: providing a first photosensitive resin layer at a first surface of a metal plate; providing a second photosensitive resin layer at a second surface of the metal plate different from the first surface; forming a first etching mask for forming a connection post on the first surface of the metal plate; forming a second etching mask for forming a wiring post on the second surface of the metal plate; forming the connection post by performing an etching on the first surface of the metal plate from a first surface side to a midway of the metal plate; applying a premold resin in liquid form to the first surface of the metal plate which underwent the etching on the first surface; forming a premold resin layer by solidifying the premold resin in liquid form being applied; and forming a wiring pattern by performing an etching on the second surface of the metal plate from a second surface side.
Inventors:
戸田 順子
馬庭 進
境 泰宏
塚本 健人
馬庭 進
境 泰宏
塚本 健人
Application Number:
JP2009064231A
Publication Date:
February 18, 2015
Filing Date:
March 17, 2009
Export Citation:
Assignee:
凸版印刷株式会社
International Classes:
H01L23/50