Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP5689606
Kind Code:
B2
Inventors:
白土 猛英
Application Number:
JP2010033191A
Publication Date:
March 25, 2015
Filing Date:
February 18, 2010
Export Citation:
Assignee:
白土 猛英
International Classes:
H01L21/76; H01L21/336; H01L21/762; H01L21/768; H01L23/532; H01L27/08; H01L29/78; H01L29/786