Title:
導電性接着剤、及びそれを用いた回路基板、電子部品モジュール
Document Type and Number:
Japanese Patent JP5728636
Kind Code:
B2
Abstract:
A conductive adhesive includes 10 to 90 wt % of Sn—Bi system solder powder and the remainder of an adhesive containing organic acid, and the Sn—Bi system solder powder is composed of solder particles having a particle size L1 of 20 to 30 μm and solder particles having a particle size L2 of 8 to 12 μm, and a mixing ratio of the Sn—Bi system solder powder is such that the solder particles having a particle size of 20 to 30 μm occupy 40 to 90 wt % with respect to the whole solder powder, and the remainder is occupied by solder particles having a particle size of 8 to 12 μm.
Inventors:
Kishi Arata
Naohisa Ohashi
Atsushi Yamaguchi
Naohisa Ohashi
Atsushi Yamaguchi
Application Number:
JP2011169966A
Publication Date:
June 03, 2015
Filing Date:
August 03, 2011
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
C09J9/02; B22F1/00; B23K35/26; C09J11/04; C09J11/06; C09J163/00; C22C12/00; H01B1/00; H01B1/22; H01B5/14; H01L21/60; H05K3/12
Domestic Patent References:
| JP11092739A | ||||
| JP11092626A | ||||
| JP2006199937A | ||||
| JP2009104930A |
Attorney, Agent or Firm:
Shin Osaka International Patent Office