Title:
混合モード配位子
Document Type and Number:
Japanese Patent JP5736590
Kind Code:
B2
Abstract:
Substrates comprising a solid support, a ligand, and a linker comprising at least one C, O, N, or S atom covalently connecting the solid support to the ligand, are disclosed, along with methods of using and making the substrates, and devices including the substrates.
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Inventors:
Hassan Ait-Haddu
Frank onie mower
Jonathan Haig
Samuel Noshhumson
Frank onie mower
Jonathan Haig
Samuel Noshhumson
Application Number:
JP2012164890A
Publication Date:
June 17, 2015
Filing Date:
July 25, 2012
Export Citation:
Assignee:
Pall Corporation
International Classes:
G01N30/88; B01J20/22; B01J20/281; B01J20/34; G01N30/26
Domestic Patent References:
| JP2008512493A | ||||
| JP2010029845A | ||||
| JP2008156617A | ||||
| JP2007524804A | ||||
| JP2010133734A | ||||
| JP2010210497A | ||||
| JP2000502951A | ||||
| JP2005539223A |
Other References:
El-Sonbati, A. Z. et al,Polymer complexes XIX. Structural chemistry of poly(2-acrylamido-1,2-diaminobenzene) complexes,Bulletin de la Societe Chemique de France,1991年,vol. 128, no. 5,pages 623-626
Attorney, Agent or Firm:
Ikeda adult
Kazuhiro Yamaguchi
Masakazu Noda
Kazuhiro Yamaguchi
Masakazu Noda