Title:
半導体材料薄片の製造装置および方法。
Document Type and Number:
Japanese Patent JP5778181
Kind Code:
B2
Abstract:
A casting device for producing semiconductor material foil includes a casting frame and a substrate band. The casting frame is arranged for holding a molten semiconductor material and includes sidewalls of which an exit sidewall is located at an output position for the semiconductor material foil. The exit side wall is provided with an exit slit. The casting device further includes a local force exerting means to exert at the location of the exit slit a locally enlarged external force on the molten semiconductor material to enlarge an outer pressure on the molten material at the exit slit.
Inventors:
Axel Georg Schönecker
Pierre Ivis Pixon
Elko Herbert Fake
Eric De Jaguar
Pierre Ivis Pixon
Elko Herbert Fake
Eric De Jaguar
Application Number:
JP2012551936A
Publication Date:
September 16, 2015
Filing Date:
February 08, 2011
Export Citation:
Assignee:
RGS DEVELOPMENT B.V.
International Classes:
C30B29/06; C01B33/02; C30B15/06; H01L31/18
Domestic Patent References:
| JP2009143795A | ||||
| JP61296940A | ||||
| JP2007534600A | ||||
| JP2001122696A |
Foreign References:
| DE10047929A1 | ||||
| WO2008132323A2 |
Attorney, Agent or Firm:
Kenji Sugimura
Yoshihiro Uemura
Hirota Taura
Yoshihiro Uemura
Hirota Taura