Title:
溶接装置及び溶接方法
Document Type and Number:
Japanese Patent JP5811613
Kind Code:
B2
Inventors:
Yuichi Miura
Koji Nezaki
Kosuke Watanabe
Koji Nezaki
Kosuke Watanabe
Application Number:
JP2011133145A
Publication Date:
November 11, 2015
Filing Date:
June 15, 2011
Export Citation:
Assignee:
Ihi Co., Ltd.
International Classes:
B23K15/00; B23K26/02; B23K26/00; B23K26/21; F02B39/00
Domestic Patent References:
| JP10299501A | ||||
| JP2001254627A | ||||
| JP2011000624A |
Attorney, Agent or Firm:
Masatake Shiga