Title:
冷却装置
Document Type and Number:
Japanese Patent JP5813300
Kind Code:
B2
Abstract:
A cooling device with which thicknesses of cover portions may be reduced. According to a first aspect of the present invention, the cooling device is equipped with a frame-shaped frame portion, cover portions, a supply port, a discharge port, and projection portions. The cover portions cover openings in the frame portion. The supply port is provided in the frame portion and supplies a cooling medium into the frame portion. The discharge port is provided in the frame portion and discharges the cooling medium in the frame portion to an exterior of the frame portion. The projection portions are projected from inner side faces of the frame portion and form a fluid channel along which the cooling medium flows in the frame portion. The cover portions are fixed to the projection portions.
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Inventors:
Sandkin Hidenori
Naoya Goto
Takahashi Yuki
Naoya Goto
Takahashi Yuki
Application Number:
JP2010186552A
Publication Date:
November 17, 2015
Filing Date:
August 23, 2010
Export Citation:
Assignee:
Sanoh Industry Co., Ltd.
International Classes:
H01L23/473; H01L23/36; H05K7/20
Domestic Patent References:
| JP2006286767A | ||||
| JP3069245U | ||||
| JP2006324647A | ||||
| JP63293865A | ||||
| JP7042919U |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda