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Title:
光半導体リフレクタ用エポキシ樹脂組成物、光半導体装置用熱硬化性樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、封止型光半導体素子ならびに光半導体装置
Document Type and Number:
Japanese Patent JP5825650
Kind Code:
B2
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Inventors:
Yuichi Fukado
Kazuhiro Fukuya
Application Number:
JP2014520092A
Publication Date:
December 02, 2015
Filing Date:
April 22, 2014
Export Citation:
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Assignee:
NITTO DENKO CORPORATION
International Classes:
H01L33/60; C08K3/22; C08K3/30; C08L63/00; H01L23/02; H01L23/08
Domestic Patent References:
JP2013091809A2013-05-16
JP2010047740A2010-03-04
JP2013040343A2013-02-28
JP2012222315A2012-11-12
JP2013091809A2013-05-16
JP2010047740A2010-03-04
Attorney, Agent or Firm:
Masahiko Nishito
Iisaki Aika
Yuko Saito



 
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