Title:
硬化性樹脂組成物、その硬化物及びそれらを用いたプリント配線板
Document Type and Number:
Japanese Patent JP5838200
Kind Code:
B2
Abstract:
In the present invention, in order to form a printed circuit board from a white cured film capable of achieving a high level of balance between pliability and high reflectivity with little reduction in reflectivity over time, a curable resin composition comprises the following: (A) a carboxyl group-containing urethane resin obtained using a non-aromatic compound having iosycyanate groups, (B) an aromatic-ring free, carboxyl group-containing resin; and (C) titanium oxide. The curable resin composition is cured by at least heating or exposure to active energy rays, and a ratio of the (A) carboxyl group-containing urethane resin and the (B) aromatic-ring free, carboxyl group-containing resin is within a range of 50 to 70: 50 to 30 by mass. A thermosetting resin composition contains (D) a thermosetting component, and a photocurable thermosetting resin composition contains (E) a monoacyl phosphine oxide photopolymerization initiator solely, or additionally (F) a bisacyl phosphine oxide photopolymerization initiator.
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Inventors:
Kazunori Nishio
Takahiro Yoshida
Takahiro Yoshida
Application Number:
JP2013509896A
Publication Date:
January 06, 2016
Filing Date:
April 09, 2012
Export Citation:
Assignee:
Taiyo Ink Manufacturing Co., Ltd.
International Classes:
C08L75/06; C08F2/50; C08K3/22; C08L101/08; H05K3/28
Domestic Patent References:
| JP2010224171A | 2010-10-07 | |||
| JP2006011395A | 2006-01-12 | |||
| JP2010224171A | 2010-10-07 | |||
| JP2006011395A | 2006-01-12 |
Foreign References:
| WO2006004158A1 | 2006-01-12 | |||
| WO2006004158A1 | 2006-01-12 |
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Atsushi Shinoda
Yumiko Sugimoto
Atsushi Shinoda