Title:
光半導体装置
Document Type and Number:
Japanese Patent JP5893874
Kind Code:
B2
Abstract:
The present invention provides an optical semiconductor device in which an optical semiconductor element connected to a silver-plated copper lead frame is sealed with an addition curing silicone resin composition, wherein the addition curing silicone resin composition comprises: (A) organopolysiloxane that contains an aryl group and an alkenyl group and does not contain an epoxy group; (B) organohydrogenpolysiloxane that has at least two hydrosilyl groups (SiH groups) per molecule and also has an aryl group, the organohydrogenpolysiloxane that contains 30 mol% or more of an HR 2 SiO 0.5 unit in a constituent unit having an amount that a molar ratio of the hydrosilyl group in the component (B) with respect to the alkenyl group in the component (A) is 0.70 to 1.00; and (C) a hydrosilylation catalyst having a catalytic amount. There can be provided an optical semiconductor device that suppresses discoloration of a cured product of an addition curing silicone resin component as a sealing resin and has excellent durability of reflection efficiency.
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Inventors:
Hamamoto Yoshihide
Manabu Ueno
Tsutomu Kashiwagi
Manabu Ueno
Tsutomu Kashiwagi
Application Number:
JP2011192013A
Publication Date:
March 23, 2016
Filing Date:
September 02, 2011
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
H01L23/29; C08L83/05; C08L83/07; H01L23/31
Domestic Patent References:
| JP20119346A | ||||
| JP2007327019A | ||||
| JP2002185046A | ||||
| JP201152115A | ||||
| JP2011159767A |
Foreign References:
| WO2008133271A1 |
Attorney, Agent or Firm:
Mikio Yoshimiya