Title:
多層レジストプロセス用無機膜形成組成物及びパターン形成方法
Document Type and Number:
Japanese Patent JP6311702
Kind Code:
B2
Abstract:
An inorganic film-forming composition for multilayer resist processes includes a complex that includes: metal atoms; at least one bridging ligand; and a ligand which is other than the at least one bridging ligand and which is derived from a hydroxy acid ester, a β-diketone, a β-keto ester, a β-dicarboxylic acid ester or a combination thereof. The at least one bridging ligand includes a first bridging ligand derived from a compound represented by formula (1). An amount of the first bridging ligand is no less than 50 mol % with respect to a total of the bridging ligand. In the formula (1), R1 represents an organic group having a valency of n. X represents —OH, —COOH, —NCO or —NHRa, wherein Ra represents a hydrogen atom or a monovalent organic group. n is an integer of 2 to 4. R1X)n (1)
Inventors:
K. Nakagawa
Tatsuya Sakai
Shunsuke Kurita
Kei Dei
Kazunori Takanashi
Yoshio Takimoto
Masayuki Motonari
Tatsuya Sakai
Shunsuke Kurita
Kei Dei
Kazunori Takanashi
Yoshio Takimoto
Masayuki Motonari
Application Number:
JP2015508171A
Publication Date:
April 18, 2018
Filing Date:
February 18, 2014
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
G03F7/11; G03F7/038; G03F7/039; G03F7/20; H01L21/027
Domestic Patent References:
| JP11258813A | ||||
| JP2002182006A | ||||
| JP2014134592A | ||||
| JP5194901A | ||||
| JP2012215878A | ||||
| JP2005537502A | ||||
| JP2010085893A | ||||
| JP2001166490A | ||||
| JP2005173552A |
Foreign References:
| WO2011024673A1 |
Attorney, Agent or Firm:
Hajime Amano