Title:
電子部品の製造方法
Document Type and Number:
Japanese Patent JP6400509
Kind Code:
B2
Abstract:
According to the present invention, a component-mounted substrate (13) having an electronic element (3) and a protruding conductive member (6) attached to a main surface (9) thereof is disposed on an upper mold (15). A plate-like member (5) having cream solder (20) applied in advance to a portion that makes contact with the conductive member (6) is disposed on the inner bottom surface of a cavity (17) of a lower mold (16). A liquid resin (21) is poured into the cavity (17), and the upper mold (15) and the lower mold (16) are clamped together so that the conductive member (6), a metal fine wire (11), the electronic element (3), a bonding pad (7), and the main surface (9) of the component-mounted substrate (13) are immersed in the liquid resin (21) and so that the conductive member (6) makes contact with the plate-like member (5) with the cream solder (2) interposed therebetween. The liquid resin (21) is cured to form a sealing resin (4) whereby a sealed substrate (22) is completed. The conductive member (6) and the plate-like member (5) are electrically connected to each other reliably by the cream solder (20) in a state where the conductive member (6) is pressed against the plate-like member (5) due to compression stress caused by curing of the liquid resin (21).
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| JPH01248510 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE USING SAME |
| WO/2017/200103 | DEMOLDING FILM |
| WO/2023/159894 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR |
Inventors:
Yasuhiro Iwata
Tomoyuki Goto
Shin Takeuchi
Tomoyuki Goto
Shin Takeuchi
Application Number:
JP2015038968A
Publication Date:
October 03, 2018
Filing Date:
February 27, 2015
Export Citation:
Assignee:
towa corporation
International Classes:
H01L23/28; H01L21/56; H01L23/00; H01L23/29
Domestic Patent References:
| JP2003249607A |