Title:
電子部品パッケージ
Document Type and Number:
Japanese Patent JP6403143
Kind Code:
B2
Abstract:
Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art.
Inventors:
Lee Kyun Ho
Woo Seung Wan
Kim Po Chul
Wang Yong Nam
Ham Suk Jin
Woo Seung Wan
Kim Po Chul
Wang Yong Nam
Ham Suk Jin
Application Number:
JP2013224084A
Publication Date:
October 10, 2018
Filing Date:
October 29, 2013
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H01L23/29; H01L23/31
Domestic Patent References:
| JP57010951A | ||||
| JP2005322839A | ||||
| JP2012114276A | ||||
| JP10116936A |
Foreign References:
| WO2008120705A1 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation