Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP6430894
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can prevent overflow of a solder from a bottom edge of a via hole while ensuring heat radiation property by filling up the via hole with the solder.SOLUTION: A semiconductor device comprises: a printed wiring board PWB having a via hole 15 and a land 12b connected to the via hole 15; a power semiconductor component PS having a heat sink 23 which is arranged on the via hole 15 and the land 12b, and connected with the land 12b by a solder. The via hole 15 has a solder resist 17 which is formed on a part of an inner wall between a first opening end OE1 on the heat sink 23 side and a second opening end OE2 on the side opposite to the heat sink 23. The solder is filled into a gap between the first opening end OE1 and the solder resist 17.SELECTED DRAWING: Figure 5
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Inventors:
Hiroshi Oyama
Application Number:
JP2015106214A
Publication Date:
November 28, 2018
Filing Date:
May 26, 2015
Export Citation:
Assignee:
Hitachi Automotive Systems, Ltd.
International Classes:
H01L23/36; H01L23/12
Domestic Patent References:
| JP2012227349A | ||||
| JP2007208123A | ||||
| JP2005340684A | ||||
| JP7249842A | ||||
| JP2009111299A | ||||
| JP3053585A |
Foreign References:
| US6820798 |
Attorney, Agent or Firm:
Kaichi International Patent Office