Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP6499400
Kind Code:
B2
Abstract:
A method of manufacturing a semiconductor device is provided. The method comprises a first step of forming a first hole opened to a side of a first surface of a semiconductor substrate, the semiconductor substrate including the first surface and a second surface opposite to the first surface, a step of filling the first hole with an insulating member, a step of forming, on the first surface, an insulating film that covers the insulating member, a step of forming a second hole in the insulating film and the insulating member, a step of filing the second hole with a conductive member, a step of thinning the semiconductor substrate from the side of the second surface of the semiconductor substrate so as to expose the insulating member.
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Inventors:
Yuya Ando
Application Number:
JP2014078231A
Publication Date:
April 10, 2019
Filing Date:
April 04, 2014
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L21/3205; H01L21/768; H01L23/522; H01L27/146
Domestic Patent References:
| JP2012222141A | ||||
| JP2013089816A | ||||
| JP2012195514A | ||||
| JP2012119381A | ||||
| JP2011029491A | ||||
| JP2005243689A | ||||
| JP2008270354A | ||||
| JP2006060067A | ||||
| JP2014003081A |
Attorney, Agent or Firm:
Yasunori Otsuka
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Osamu Shimoyama
Nagakawa Yukimitsu
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Osamu Shimoyama
Nagakawa Yukimitsu