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Title:
ポリブチレンテレフタレート樹脂組成物、及び金属複合部品
Document Type and Number:
Japanese Patent JP6527964
Kind Code:
B2
Abstract:
A polybutylene terephthalate resin composition which contains (A) a polybutylene terephthalate resin, (B) a polyethylene terephthalate resin and (C) an epoxy group-containing olefin copolymer that contains (c-1) a constituent unit derived from an α-olefin and (c-2) a constituent unit derived from a glycidyl ester of an á, β-unsaturated acid. A molded article of this polybutylene terephthalate resin composition, which is molded at a molding temperature of 260°C under a holding pressure of 80 MPa with a mold temperature of 80°C in accordance with ISO 3167 (Type A test piece), has a surface roughness of 0.50 μm or less. The content of the epoxy groups in the epoxy group-containing olefin copolymer (C) is from 0.01% by mass to 0.35% by mass (inclusive) relative to the total mass of the polybutylene terephthalate resin composition; and the content of (meth)acrylate ester structures is 1.5% by mass or less relative to the total mass of the polybutylene terephthalate resin composition.

Inventors:
Atsuko Ishida
Hiroyuki Hase
Hidemizu Kondo
Application Number:
JP2017559185A
Publication Date:
June 12, 2019
Filing Date:
December 26, 2016
Export Citation:
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Assignee:
Wintech Polymer Co., Ltd.
International Classes:
C08L67/02; B32B15/09; C08J5/12; C08K7/14; C08L63/00
Domestic Patent References:
JP11335534A
JP2004143282A
JP2015229679A
JP2003291261A
JP2000178422A
JP2014185255A
JP2013159732A
JP2009173900A
JP2006249260A
JP201146950A
Foreign References:
WO2015146718A1
WO2014021409A1
WO2011155287A1
Other References:
ボンドファースト(R),住友化学株式会社,2014年 3月
Attorney, Agent or Firm:
Hidekazu Miyoshi