Title:
レーザ加工装置、発光装置の製造装置、および発光装置の製造方法
Document Type and Number:
Japanese Patent JP6551644
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing device which can suppress adhesion of processed powder to a light-emitting device.SOLUTION: A manufacturing device 200 for a light-emitting device 10 is equipped with: an irradiation part 210 which processes a light-emitting device 10 by irradiation of laser beam 230; a suction part 40 which sucks processed powder generated by said processing; and an attraction part 50 which performs electrostatic attraction of the processed powder sucked by the suction part by electrical charging. The attraction part 50 has a cylindrical shape which forms an opening 51 for passing laser beam 230, and an area of the opening 51 at an end on the light-emitting device 10 side of the attraction part 50 is smaller than an area of the opening 51 at an end on the irradiation part 210 side of attraction part 50.SELECTED DRAWING: Figure 4
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Inventors:
Satoshi Nakamura
Tokuo Yoshida
Jun Goda
Tokuo Yoshida
Jun Goda
Application Number:
JP2014208367A
Publication Date:
July 31, 2019
Filing Date:
October 09, 2014
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
B23K26/16; B23K26/00; H01L33/50
Domestic Patent References:
| JP2020684A | ||||
| JP48029096A | ||||
| JP5089771A | ||||
| JP2012148300A | ||||
| JP2002344029A |
Attorney, Agent or Firm:
Hiromori Arai
Eisaku Teratani
Shinichi Michisaka
Eisaku Teratani
Shinichi Michisaka