Title:
アライナ構造及びアライン方法
Document Type and Number:
Japanese Patent JP6582059
Kind Code:
B2
Abstract:
The present disclosure is directed to an aligner structure and an alignment method for processing a substrate when a substrate and a mask are vertically arranged by providing an alignment structure for fixing and aligning the substrate and the mask with each other while the substrate and the mask are vertically arranged. The aligner structure comprises a mask clamping portion which is installed in the process chamber to clamp the mask; a substrate clamping portion which clamps a substrate carrier on which the substrate is held by an electrostatic chuck; an alignment portion which relatively moves the substrate carrier with respect to the mask such that the substrate and the mask are aligned with each other; and an adhesion driving portion which causes the substrate and the mask, which are aligned by the alignment portion, to adhere to each other.
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Inventors:
Cho, Senhyun
Ann, Song Il
Ann, Song Il
Application Number:
JP2017551043A
Publication Date:
September 25, 2019
Filing Date:
April 01, 2016
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
C23C14/04; H01L21/683; H01L51/50; H05B33/10
Domestic Patent References:
| JP2012140671A | ||||
| JP2005120476A | ||||
| JP2014133923A |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation