Title:
硬化性組成物
Document Type and Number:
Japanese Patent JP6588556
Kind Code:
B2
Abstract:
The present application relates to a curable composition and a use thereof. The present application can provide a curable composition having excellent transparency, heat resistance and adhesion. Such a curable composition can be usefully used in direct bonding between a filler and an optical member of a display device.
Inventors:
Si Young Baek
Sun Min Lee
Min So Park
Se U Yang
Seo Yeon Kim
Sun Min Lee
Min So Park
Se U Yang
Seo Yeon Kim
Application Number:
JP2017539576A
Publication Date:
October 09, 2019
Filing Date:
February 22, 2017
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08F299/08; C08G18/61; C08L75/04; C08L75/16; C08L83/04
Domestic Patent References:
| JP10287717A | ||||
| JP2006052356A | ||||
| JP2002138127A | ||||
| JP2001261765A | ||||
| JP7305001A | ||||
| JP61272224A |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe