Title:
多層型接着接合体のプラズマ処理
Document Type and Number:
Japanese Patent JP6612830
Kind Code:
B2
Abstract:
Method for bonding by wrapping a medium which is capable of expanding transversely to a winding with an adhesive tape, in which: an adhesive tape is unrolled from an adhesive tape roll, the unrolled adhesive tape is provided on one side of a carrier film (1) with an adhesive cement layer (2) and on an opposite side with a separating agent layer (3), the separating agent layer (3) is subjected to a plasma treatment, the plasma-treated adhesive tape is wound around the medium which is capable of expanding transversely to a winding, so that at least a portion of the adhesive tape is bonded to a lower winding ply by the adhesive cement layer (2).
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Inventors:
Marcel Henel
Christoph Nagel
Yenifer Kipke
Janic Sellin
Christoph Nagel
Yenifer Kipke
Janic Sellin
Application Number:
JP2017202424A
Publication Date:
November 27, 2019
Filing Date:
October 19, 2017
Export Citation:
Assignee:
Theza Societas Europe
International Classes:
C09J5/02; B32B27/00; C08J7/00; C09J7/29; C09J201/00
Domestic Patent References:
| JP2012233038A |
Foreign References:
| US5106383 |
Attorney, Agent or Firm:
Mitsufumi Esaki
Blacksmith
Katsunori Uenishi
Ichiro Torayama
Blacksmith
Katsunori Uenishi
Ichiro Torayama