Title:
フィラメントを組み込むための物理的な予備処理
Document Type and Number:
Japanese Patent JP6612829
Kind Code:
B2
Abstract:
Method for producing an adhesive tape including the steps of providing an adhesive layer to at least one side of a liner or a carrier film and treating at least one filament and/or the adhesive layer with a plasma, and introducing the at least one filament into the adhesive layer.
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Inventors:
Marcel Henel
Christoph Nagel
Yenifer Kipke
Janic Sellin
Christoph Nagel
Yenifer Kipke
Janic Sellin
Application Number:
JP2017202423A
Publication Date:
November 27, 2019
Filing Date:
October 19, 2017
Export Citation:
Assignee:
Theza Societas Europe
International Classes:
C09J7/38; C09J11/04; C09J11/08; C09J201/00
Domestic Patent References:
JP7040756U | ||||
JP2002161256A | ||||
JP2003301370A | ||||
JP60185862A | ||||
JP2009543713A |
Attorney, Agent or Firm:
Mitsufumi Esaki
Blacksmith
Katsunori Uenishi
Ichiro Torayama
Blacksmith
Katsunori Uenishi
Ichiro Torayama