Title:
タングステンのバフ研磨用組成物
Document Type and Number:
Japanese Patent JP6616394
Kind Code:
B2
Abstract:
A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier and colloidal silica abrasive particles dispersed in the liquid carrier. The colloidal silica abrasive particles have a permanent positive charge of at least 6 mV. About 30 percent or more of the colloidal silica abrasive particles include three or more aggregated primary particles.
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Inventors:
Furin
Jeffrey Dizard
Stephen Gran Bean
Jeffrey Dizard
Stephen Gran Bean
Application Number:
JP2017501124A
Publication Date:
December 04, 2019
Filing Date:
March 20, 2015
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORPORATION
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| JP2010080499A | ||||
| JP2010541204A | ||||
| JP2008503875A | ||||
| JP2009239009A |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Naori Kota
Satoshi Deno
Kenji Kimura
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Naori Kota
Satoshi Deno
Kenji Kimura