Title:
プロピレン系樹脂発泡粒子及び発泡粒子成形体
Document Type and Number:
Japanese Patent JP6620387
Kind Code:
B2
Abstract:
Provided is an expanded propylene resin bead including a core layer in a foamed state, which includes a propylene-based resin composition (a) satisfying the following (i) and (ii); and a cover layer which includes an olefin-based resin (b) satisfying the following (iii) or (iv):
(i) the propylene-based resin composition (a) is a mixture of 65% by weight to 98% by weight of a propylene-based resin (a1) having a melting point of 145°C to 165°C and a flexural modulus of 1,200 MPa or more and 35% by weight to 2% by weight of a propylene-based resin (a2) having a melting point of 100°C to 145°C and a flexural modulus of 800 MPa to 1,200 MPa;
(ii) a difference in a melting point between the resin (a1) and the resin (a2) is 5°C to 25°C;
(iii) the olefin-based resin (b) is a crystalline olefin-based resin having a melting point (TmB) that is lower than a melting point (TmA) of the composition (a) and being in a relation of (0°C < [TmA - TmB] ‰¤ 80°C); and
(iv) the olefin-based resin (b) is a non-crystalline olefin-based resin having a softening point (TsB) that is lower than the TmA and being in a relation of (0°C < [TmA - TsB] ‰¤ 100°C).
Inventors:
Masaharu Oikawa
Koshida Exhibition
Shota Takagi
Koshida Exhibition
Shota Takagi
Application Number:
JP2016568259A
Publication Date:
December 18, 2019
Filing Date:
January 09, 2015
Export Citation:
Assignee:
JSP Corporation
International Classes:
C08J9/16; C08J9/228
Domestic Patent References:
JP2004176047A | ||||
JP10077359A | ||||
JP2003039565A | ||||
JP2004068016A | ||||
JP2011016914A |
Foreign References:
WO2010150466A1 | ||||
WO2009001626A1 |
Attorney, Agent or Firm:
Kenichi Hirasawa
Wataru Sasaki
Wataru Sasaki