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Title:
導電性パターンの形成方法
Document Type and Number:
Japanese Patent JP6658418
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a conducting pattern, which enables the decrease in the line width of a conductive thin wire that the conducting pattern includes, and which enables the improvement in the conductivity of the conducting pattern.SOLUTION: A method for forming a conducting pattern comprises the steps of: applying an ink 2 including metal nanoparticles onto a base material 1; and drying the ink, thereby forming parallel conducting patterns 31, 32 on the base material. In the method, the base material has a surface energy of 40 mN/m or less; the content of the metal nanoparticles in the ink is 5 wt.% or less; and the ink contains, as a dispersant, one or more kinds of hydrophobicity organic solvent of 95 wt.% or more to a total content of the ink.SELECTED DRAWING: Figure 1

Inventors:
Naoto Niizuma
Hidenobu Oya
Masayoshi Yamauchi
Takenori Omata
Application Number:
JP2016177125A
Publication Date:
March 04, 2020
Filing Date:
September 09, 2016
Export Citation:
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Assignee:
Konica Minolta Co., Ltd.
International Classes:
H05K3/12; H01B1/22; H01B13/00; H05K1/09
Domestic Patent References:
JP2014120353A
JP2010166015A
JP2009283931A
Foreign References:
WO2015005457A1
Attorney, Agent or Firm:
Eiichi Maruyama



 
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