Title:
封口体及び電解コンデンサ
Document Type and Number:
Japanese Patent JP6660700
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To inhibit droplets generated in a case from adhering to a pressure valve.SOLUTION: A through hole 30 is formed at a sealing body 3b. A first wall part 31 and a second wall part 32 formed at a case outer side of the first wall part 31 are formed on an inner peripheral wall defining a side peripheral surface of the through hole 30 of the sealing body 3b. The second wall part 32 protrudes to a radial center part of the through hole 30 further than the first wall part 31.SELECTED DRAWING: Figure 3
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Inventors:
Mitsuru Yoneda
Kenta Kawanishi
Kenta Kawanishi
Application Number:
JP2015194661A
Publication Date:
March 11, 2020
Filing Date:
September 30, 2015
Export Citation:
Assignee:
Nichicon Co., Ltd.
International Classes:
H01G9/12; H01G11/14
Domestic Patent References:
| JP2002313303A | ||||
| JP55095261U | ||||
| JP2014127692A | ||||
| JP2008198664A | ||||
| JP51107628U | ||||
| JP51092628U | ||||
| JP50105520U | ||||
| JP56007268U | ||||
| JP2014120360A | ||||
| JP2010267507A |
Attorney, Agent or Firm:
Kaji/Suhara Patent Office