Title:
半導体用ダイアタッチペースト及び半導体装置
Document Type and Number:
Japanese Patent JP6675155
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a die attach paste that suppresses bleed-out, prevents dripping and bleeding, and has excellent storage stability and workability, and a reliable semiconductor device.SOLUTION: The die attach paste for semiconductor is improved in thixotropic properties by including as essential components an epoxy resin, a hardening agent, a hardening accelerator, a polymer ion dispersant containing polycarboxylic acid as a main skeleton, and a spherical filler. The semiconductor device is formed by fixing a semiconductor element 2 and a lead frame 1 through an adhesive layer 3 formed by hardening the die attach paste for semiconductor.SELECTED DRAWING: Figure 1
Inventors:
Taniguchi Courage
Aya Oshima
Aya Oshima
Application Number:
JP2015103006A
Publication Date:
April 01, 2020
Filing Date:
May 20, 2015
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L21/52; C08G59/22; C08L63/00; C09J11/04; C09J11/06; C09J11/08; C09J163/00
Domestic Patent References:
| JP2014177539A | ||||
| JP2000178342A | ||||
| JP2009177003A | ||||
| JP2014040533A | ||||
| JP2015026519A | ||||
| JP2010135180A | ||||
| JP2012216425A |
Foreign References:
| WO2009057530A1 | ||||
| WO2013153803A1 | ||||
| WO2011104996A1 | ||||
| WO2013125086A1 |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office