Title:
積層型受光センサ及び車載撮像装置
Document Type and Number:
Japanese Patent JP6705044
Kind Code:
B2
Abstract:
Advanced processing is performed in a chip. A stacked light-receiving sensor according to an embodiment includes a first substrate (100, 200, 300) and a second substrate (120, 320) bonded to the first substrate. The first substrate includes a pixel array (101) in which a plurality of unit pixels are arranged in a two-dimensional matrix. The second substrate includes a converter (17) configured to convert an analog pixel signal output from the pixel array to digital image data and a processing unit (15) configured to perform a process based on a neural network calculation model for data based on the image data. At least a part of the converter is arranged on a first side in the second substrate. The processing unit is arranged on a second side opposite to the first side in the second substrate.
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Inventors:
Yoshihito
Application Number:
JP2019139481A
Publication Date:
June 03, 2020
Filing Date:
July 30, 2019
Export Citation:
Assignee:
Sony Semiconductor Solutions Corporation
International Classes:
H04N5/369; G06V10/147; G06V10/764; H01L27/146; H04N5/225; H04N5/232
Domestic Patent References:
| JP2018107759A | ||||
| JP2018074445A | ||||
| JP2016218900A | ||||
| JP2017118445A |
Attorney, Agent or Firm:
Sakai International Patent Office