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Title:
改善された硬化速度を有する安定した熱重合性ビニル、アミノ、またはオリゴマーフェノキシベンゾキシシクロブテンモノマーを製造する方法
Document Type and Number:
Japanese Patent JP6706658
Kind Code:
B2
Abstract:
The present invention provides methods of making low energy polymerizable monomers and resins for use in making dielectric materials. The methods comprise deprotecting or deacylating an organic alkali cleavable protecting group containing addition polymerizable, amine containing aromatic monomer or oligoaromatic phenol resin containing an organic alkali cleavable protecting group, such as a C2to C9alkanoyl group, preferably, an acyl group, by hydrolyzing to remove the protecting group in organic alkali in a polar solvent containing an excess of alkali C1to C7alkoxide and form a hydroxyl functional monomer or resin, followed by; reacting via nucleophilic substitution the resulting hydroxyl functional monomer or resin with an alpha-halide (a-halide) or strong acid conjugate leaving group containing arylcyclobutene compound in a polar solvent, to yield a product an arylcyclobutene-containing addition polymerizable or amine containing aromatic monomer or oligoaromatic phenol resin having an ether linkage from the cyclobutene ring to an aromatic group of the addition polymerizable aromatic monomer, aromatic amine or oligoaromatic phenol.

Inventors:
Colin Hayes
Michael Kay Gallagher
Michael liener
Application Number:
JP2018208511A
Publication Date:
June 10, 2020
Filing Date:
November 06, 2018
Export Citation:
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Assignee:
Rohm and Haas Electronic Materials LLC
International Classes:
C08F12/32; C07C41/16; C07C43/243
Domestic Patent References:
JP2015131958A
JP2015130496A
JP63501157A
JP7165626A
JP5301829A
JP5132432A
Foreign References:
WO2017031622A1
CN101226786A
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office