Title:
付加製造システムおよび付加製造方法
Document Type and Number:
Japanese Patent JP6707319
Kind Code:
B2
Abstract:
An additive manufacturing system (10) for forming a component (12) on a layer-by-layer basis includes a first pump (26) for pumping a first material and a second pump (28) for pumping a second material. The additive manufacturing system (10) further includes a mixer (16) for receiving and mixing the first material and the second material to form a thermosetting resin, a nozzle (14) fluidly connected to the mixer (16) for extruding the thermosetting resin, and a motion control system (15) connected to the nozzle (14) for moving the nozzle (14) in a predetermined pattern to form a layer of the component (12).
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Inventors:
Michael paul humbert
John P. Wesson
Brian M. Welch
John P. Wesson
Brian M. Welch
Application Number:
JP2015111025A
Publication Date:
June 10, 2020
Filing Date:
June 01, 2015
Export Citation:
Assignee:
UNITED TECHNOLOGIES CORPORATION
International Classes:
B29C64/106; B01F3/08; B01F5/00; B29C64/336; B29C64/393; B33Y10/00; B33Y30/00; B33Y40/00; B33Y50/02
Domestic Patent References:
JP11042712A | ||||
JP2003519022A | ||||
JP2007268988A | ||||
JP1232024A | ||||
JP2009154049A | ||||
JP2011511719A | ||||
JP2010100805A | ||||
JP2007261002A | ||||
JP4059342A | ||||
JP2013517922A |
Foreign References:
US6454972 | ||||
WO2013171292A1 | ||||
US6129872 | ||||
US20140079841 | ||||
US20100140852 |
Attorney, Agent or Firm:
Hiromichi Kobayashi
Tomioka Kiyoshi
Tomioka Kiyoshi