Title:
配線回路基板
Document Type and Number:
Japanese Patent JP6715368
Kind Code:
B2
Abstract:
To provide a wiring circuit board which can improve the problem attributed to the location of a terminal part, etc. in a layer direction to stabilize the rigidity.SOLUTION: A wiring circuit board 7 comprises: a metal support layer 31 for making a substrate; an electrically insulating layer 33 formed by lamination on a surface of the metal support layer 31; and a wiring layer 35 having a general part 35a laminated on the surface of the electrically insulating layer 33 and wired, and a terminal part 35b coupled to the general part 35a and serving to make an electrical connection to the outside. The wiring layer 35 has a stepped part 35c forming a step of the layer to make the terminal part 35b protrude with respect to the general part 35a in its thickness direction. The terminal part 35b is located over the opening 45 of the metal support layer 31 and the electrically insulating layer 33 on a leading end side. The stepped part 35c is supported by a tongue part 33b of the electrically insulating layer 33, which is formed to be smaller, in thickness, than a main body of the electrically insulating layer 33.SELECTED DRAWING: Figure 2
Inventors:
Yukie Yamada
Application Number:
JP2019077751A
Publication Date:
July 01, 2020
Filing Date:
April 16, 2019
Export Citation:
Assignee:
Nippon Jojo Co., Ltd.
International Classes:
H05K1/05; G11B5/60; H05K1/02
Domestic Patent References:
| JP2013200934A | ||||
| JP2011175706A | ||||
| JP2012009111A | ||||
| JP2013054817A | ||||
| JP2014089797A |
Attorney, Agent or Firm:
Yuichi Sudo
Daisuke Sudo
Daisuke Sudo