Title:
処理対象物を保持するためのテーブルおよび該テーブルを有する処理装置
Document Type and Number:
Japanese Patent JP6719271
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent a treatment liquid as much as possible from being sucked into small holes of a table intended to vacuum-suction a substrate.SOLUTION: There is provided a wet-type substrate processing device for processing a substrate. The wet-type substrate processing device includes: a table for holding the substrate; and a treatment liquid feeding mechanism for feeding a treatment liquid to the substrate held by the table. The table includes: a support surface for supporting the substrate; first aperture parts formed in the support surface; second aperture parts formed in the support surface and disposed so as to at least partly surround the first aperture parts; a first fluid channel extending through the table to the first aperture parts of the support surface and constituted to be connectable to a vacuum source; and a second fluid channel extending through the table to the second aperture parts of the support surface and constituted to drain the treatment liquid.SELECTED DRAWING: Figure 3A
Inventors:
Naoki Toyomura
Miya Saki
Junji Kunizawa
Miya Saki
Junji Kunizawa
Application Number:
JP2016096276A
Publication Date:
July 08, 2020
Filing Date:
May 12, 2016
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B37/30; H01L21/304; H01L21/683
Domestic Patent References:
| JP2001044151A | ||||
| JP2000127025A | ||||
| JP9262756A |
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yukio Kanegae
Makoto Watanabe
Toru Miyamae
Yukio Kanegae
Makoto Watanabe