Title:
プラズマを用いた処理装置及び処理対象物にプラズマを照射する処理を行う処理方法
Document Type and Number:
Japanese Patent JP6792754
Kind Code:
B2
Abstract:
In order to provide a processing device and a processing method employing plasma with which stability of maintaining a plasma lighting state is improved, while microwaves having a pulsed microwave power are used as the microwaves for generating the plasma, a processing device (10) employing plasma (25), according to the present invention, is provided with a processing chamber (14) for performing a process to irradiate a processing target (13) with the plasma (25), and a microwave supply unit (17) which supplies microwaves for generating the plasma (25) into the processing chamber (14), wherein the microwave supply unit (17) supplies first microwaves having a pulsed first microwave power in which a difference between a maximum value and a minimum value of the microwave power is at least equal to a first amplitude, and second microwaves having a steady second microwave power with little variation in the microwave power.
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Inventors:
Riki Takizawa
Toshihiro Oishi
Mineo Morimoto
Yuichi Sakamoto
Toshihiro Oishi
Mineo Morimoto
Yuichi Sakamoto
Application Number:
JP2018213578A
Publication Date:
December 02, 2020
Filing Date:
November 14, 2018
Export Citation:
Assignee:
S.E. Co., Ltd.
International Classes:
H05H1/46
Domestic Patent References:
| JP2014107363A | ||||
| JP2003173757A | ||||
| JP2007273189A | ||||
| JP2001168086A | ||||
| JP63184300A | ||||
| JP2008016404A |
Attorney, Agent or Firm:
Tomohiro Sakamoto