Title:
封止用エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP6792800
Kind Code:
B2
Abstract:
To provide an encapsulant that is an epoxy resin composition for encapsulating an electronic component and a semiconductor device and has, after curing, flexibility and good transparency and adhesiveness without warpage or cracks.SOLUTION: An epoxy resin composition for encapsulation comprises: an epoxy resin; a polymer (A) of a monomer mixture comprising a monomer having a glycidyl group or oxetanyl group and a monomer represented by the general formula (1) in the figure; and a curative; where the content of the polymer (A) is 1-300 pts.mass based on 100 pts.mass of the epoxy resin. (In the formula, X and Y each independently represent NH or O.)SELECTED DRAWING: None
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Inventors:
Eiji Harada
Atsushi Nagasawa
Atsushi Nagasawa
Application Number:
JP2017103230A
Publication Date:
December 02, 2020
Filing Date:
May 25, 2017
Export Citation:
Assignee:
NOF CORPORATION
International Classes:
C08G59/20; H01L23/29; H01L23/31
Domestic Patent References:
| JP2005213337A |
Attorney, Agent or Firm:
Masumi Hosoda
Juno Aoki
Juno Aoki