Title:
鉛フリーはんだ合金、ソルダペースト組成物、電子回路基板および電子制御装置
Document Type and Number:
Japanese Patent JP6795630
Kind Code:
B2
Abstract:
To provide a lead-free solder alloy, a solder paste composition, an electronic circuit board, and an electronic controller that can suppress cracking development of a solder joint part even in a severe environment in which differences in temperature are large and a load of vibration is placed, and also suppress cracking development nearby a boundary surface between an electronic component and the solder joint part even when the electronic component has neither Ni/Pd/Au plating nor Ni/Au plating performed on and is soldered.SOLUTION: The present invention relates to a lead-free solder alloy consisting of 1-2 wt.% of Ag, 0.5-0.7 wt.% of Cu, 2-4 wt.% of Sb, 2-4.5 wt.% of Bi, 0.01-0.03 wt.% of Ni, and Sn for the rest.SELECTED DRAWING: Figure 1
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Inventors:
Masaya Arai
Ken Nakano
Atsushi Hori
Katsuyama Tsukasa
Soukawa Yurika
Ken Nakano
Atsushi Hori
Katsuyama Tsukasa
Soukawa Yurika
Application Number:
JP2019003004A
Publication Date:
December 02, 2020
Filing Date:
January 10, 2019
Export Citation:
Assignee:
TAMURA CORPORATION OF CHINA LIMITED
International Classes:
B23K35/26; B23K35/22; C22C13/00; C22C13/02; H05K3/34
Domestic Patent References:
| JP6047254B1 | ||||
| JP6125084B1 | ||||
| JP5349703B1 | ||||
| JP5811304B2 | ||||
| JP5324007B1 | ||||
| JP4787384B1 | ||||
| JP2014065065A |
Foreign References:
| WO2014163167A1 |
Attorney, Agent or Firm:
Yoko Ota