Title:
回路付サスペンション基板
Document Type and Number:
Japanese Patent JP6818169
Kind Code:
B2
Abstract:
To provide a suspension substrate with circuits capable of securely connecting a connection terminal to a terminal of a slider, and a manufacturing method of the suspension substrate with circuits.SOLUTION: A suspension substrate 1 for circuits includes a metal support substrate 8, a base insulating layer 9 arranged on the metal support substrate 8, and a conductor layer 10 having a head-side terminal 58 that is arranged on the base insulating layer 9 and electrically connected to a slider 4. The base insulating layer 9 has a terminal region 62 that at least overlaps with the head-side terminal 58 when projected in a thickness direction, and a peripheral region 63 that does not overlap with the terminal region 62 and that surrounds the terminal region 62. The thickness of the terminal region 62 is thicker than the thickness of the peripheral region 63.SELECTED DRAWING: Figure 3
More Like This:
| JPH02121112 | MAGNETIC HEAD |
| JP2016171200 | METHODS FOR MANUFACTURING AND INSPECTING WIRING CIRCUIT BOARD |
Inventors:
Hiroyuki Tanabe
Naohiro Terada
Yu Sugimoto
Daisuke Yamauchi
Naohiro Terada
Yu Sugimoto
Daisuke Yamauchi
Application Number:
JP2020002769A
Publication Date:
January 20, 2021
Filing Date:
January 10, 2020
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
G11B5/60; G11B21/21; H05K3/44
Domestic Patent References:
| JP2013200934A | ||||
| JP2012104210A | ||||
| JP2012099204A | ||||
| JP6646425B2 |
Attorney, Agent or Firm:
Hiroyuki Okamoto
Shinichi Uda
Shinichi Uda