Title:
創傷治癒に対するＡＰＣ類似体の使用
Document Type and Number:
Japanese Patent JP6873387
Kind Code:
B2
Abstract:
The invention relates to wound repair and healing, particularly to dermal or cutaneous wounds including but not limited to acute and chronic wounds, burns and ulcers.
Inventors:
Shwe Meylan
Jackson Christopher John
Jackson Christopher John
Application Number:
JP2017505687A
Publication Date:
May 19, 2021
Filing Date:
April 16, 2015
Export Citation:
Assignee:
GI Biotech LLC
International Classes:
A61K38/17; A61P17/02
Other References:
Current Pharmaceutical Design,2012年,Vol.18,pp.4215-4222
Attorney, Agent or Firm:
Patent Business Corporation Saegusa International Patent Office