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Patent Searching and Data


Title:
熱接着テープの製造方法
Document Type and Number:
Japanese Patent JP6896445
Kind Code:
B2
Abstract:
Provided is a thermal adhesion tape which promotes hardening of an adhesive layer when heated, and which is less likely to be hardened when it is not heated during storage or the like. The thermal adhesion tape (1) of the present invention is a thermal adhesive tape (1) thermally bonded to an adhered body by thermocompression bonding, and includes a base material (2) formed of a non-woven fabric, and an adhesive layer (3) which is provided on each of one and the other surface sides of the base material (2), and contains an acrylonitrile-butadiene rubber, a phenol resin, a peroxide which is decomposed to generate an acid, and a phenol resin crosslinking agent, wherein the peroxide has a half-life temperature of 130 DEG C or higher and 170 DEG C or lower, and when the acrylonitrile-butadiene rubber is used in an amount of 100 parts by mass, the adhesive layer (3) contains 0.5 parts by mass or more and 5 parts by mass or less of the peroxide.

Inventors:
Mitsuyoshi Goda
Kenichi Serita
Akira Masuda
Takahiro Sakai
Application Number:
JP2017024804A
Publication Date:
June 30, 2021
Filing Date:
February 14, 2017
Export Citation:
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Assignee:
Maxell Holdings Co., Ltd.
International Classes:
C09J7/35; C09J11/06; C09J109/02; C09J161/04
Domestic Patent References:
JP4348177A
JP5179218A
Attorney, Agent or Firm:
Jiro Kobe