Title:
電解金合金めっき浴及び電解金合金めっき方法
Document Type and Number:
Japanese Patent JP7352515
Kind Code:
B2
Abstract:
To provide a stable electrolytic gold alloy plating bath and an electrolytic gold alloy plating method in which deposition rate is fast, alloy ratio can be controlled even with a high electric-current density applied, a gold alloy plating film has a uniform thickness, and air oxidation resistance is maintained.SOLUTION: An electrolytic gold alloy plating bath and an electrolytic gold alloy plating method include a monovalent gold (I), an alloying element, a hydantoin compound, and hydantoins.SELECTED DRAWING: Figure 1
Inventors:
Takanobu Asakawa
Application Number:
JP2020087563A
Publication Date:
September 28, 2023
Filing Date:
May 19, 2020
Export Citation:
Assignee:
EEJA Co., Ltd.
International Classes:
C25D3/62; C25D3/64
Domestic Patent References:
| JP60141891A | ||||
| JP2005256072A |
Foreign References:
| CN108441901A | ||||
| CN105401180A |
Attorney, Agent or Firm:
Satoru Miyazaki