Title:
半導体装置
Document Type and Number:
Japanese Patent JP7352750
Kind Code:
B2
Abstract:
A semiconductor device, comprising a memory chip (100) and a temperature measurement module (110). The temperature measurement module (110) is used for measuring the temperature of the memory chip (100). The temperature measurement module (110) comprises: a temperature measurement unit (111) used for measuring the temperature of the memory chip (100) and outputting an analog signal corresponding to the temperature; and an A/D conversion module (112) comprising multiple comparison units (Px). Each comparison unit (Px) comprises an input end, a reference end, and an output end; the input ends receive analog signals output by the temperature measurement unit (111); the output ends output digital signals; and reference voltages received by the reference ends of the multiple comparison units (Px) increase non-uniformly. The use of the temperature measurement module (110) for measurement of the temperature of the memory chip (100) prevents the starting and running of the memory chip (100) at a low temperature, thereby shortening the write time and improving the write stability of the memory chip (100); and in addition, the control of the measurement accuracy of different voltage areas ensures the measurement accuracy of areas requiring accurate measurement and improves the measurement efficiency.
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Inventors:
▲ニン▼ 樹梁
Application Number:
JP2022552660A
Publication Date:
September 28, 2023
Filing Date:
November 11, 2020
Export Citation:
Assignee:
CHANGXIN MEMORY TECHNOLOGIES,INC.
International Classes:
G11C7/04; G01K7/00; G01K7/01; G11C5/04
Domestic Patent References:
| JP201855759A | ||||
| JP6276098A | ||||
| JP2007192718A |
Foreign References:
| US20050185491 |
Attorney, Agent or Firm:
Norito Yamao
Hidehiro Tokuyama
Hidehiro Tokuyama