Document Type and Number:
Japanese Patent JPH0214554
Kind Code:
U
More Like This:
Application Number:
JP8887088U
Publication Date:
January 30, 1990
Filing Date:
July 04, 1988
Export Citation:
International Classes:
F23D3/18; F23Q7/08; (IPC1-7): F23Q7/08; F23D3/18
Next Patent: RESIN-SEALED TYPE SEMICONDUCTOR DEVICE