Title:
【考案の名称】表面実装型半導体装置
Document Type and Number:
Japanese Patent JPH04134857
Kind Code:
U
Inventors:
Akio Otsuka
Application Number:
JP4267891U
Publication Date:
December 15, 1992
Filing Date:
June 07, 1991
Export Citation:
International Classes:
H01L23/48; (IPC1-7): H01L23/48