Title:
【発明の名称】導電性膜付ガラスセラミック基板
Document Type and Number:
Japanese Patent JPH06103787
Kind Code:
B2
Abstract:
A glass ceramic substrate (1) containing mica and having an electrically conductive film (2) formed thereon includes a bonding layer (3) made of a material including at least silicon oxide, which is formed on a portion of one of the opposite surfaces of the glass ceramic substrate containing mica. The electrically conductive film is formed on the bonding layer and has a major component consisting of at least one element selected from the group consisting of alminum, tungsten, molybdenum, titanium, tantalum and chromium.
Inventors:
Yukihisa Takeuchi
Masayasu Ishikawa
Koji Kimura
Masayasu Ishikawa
Koji Kimura
Application Number:
JP18576088A
Publication Date:
December 14, 1994
Filing Date:
July 26, 1988
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
C23C14/06; C03C17/36; C23C14/18; C23C16/06; C23C28/00; C23C30/00; H05K1/03; H05K3/18; H05K3/38; (IPC1-7): H05K3/38; H05K1/03; H05K3/18
Domestic Patent References:
| JP5599792A | ||||
| JP62238767A | ||||
| JP62297286A |
Attorney, Agent or Firm:
Michio Nakajima (2 outside)
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