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Title:
【考案の名称】半導体素子収納用パッケージ
Document Type and Number:
Japanese Patent JPH0610695
Kind Code:
Y2
Inventors:
Sueyoshi Takashi
Masayuki
Kijima Masahiro
Application Number:
JP14580287U
Publication Date:
March 16, 1994
Filing Date:
September 24, 1987
Export Citation:
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Assignee:
Continental Automotive GmbH
International Classes:
H01L23/34; H01L23/40; (IPC1-7): H01L23/40
Domestic Patent References:
JP64073750A
JPS5471572A
JP61168640B



 
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