Title:
【発明の名称】多リード数パッケージにおける被覆ボンディングワイヤ
Document Type and Number:
Japanese Patent JPH09502833
Kind Code:
A
Abstract:
A transfer molded high lead count plastic semiconductor package is described. The packaged IC chip is mounted upon a suitable leadframe and the bonding pads wire bonded to the leadframe fingers. To avoid wire shorting, due to wire sweep during transfer molding, the wires are first coated with an insulative material.
Inventors:
Wailer, Peter, M
Burke, Thomas, S
Burke, Thomas, S
Application Number:
JP50512495A
Publication Date:
March 18, 1997
Filing Date:
May 20, 1994
Export Citation:
Assignee:
NATIONAL SEMICONDUCTOR CORPORATION
International Classes:
H01L23/29; H01L21/56; H01L21/60; H01L23/31; H01L23/49; (IPC1-7): H01L21/60; H01L21/56; H01L21/60; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Kaoru Furuya (2 outside)